Currently underway, MWC Shanghai has seen Honor CEO George Zhao deliver a keynote speech on innovation and evolution in the mobile phone industry. During his presentation, he announced that the new Honor Magic V2 will be launched on July 12, promising to “revolutionize the foldable experience.”
Compared to the initial Magic V, the previous release offered a 10% lighter body and an improved hinge. While the CEO did not disclose specific details about what will make the V2 revolutionary, it is anticipated that Honor will address some of the drawbacks of its predecessors. Expectations include features such as waterproofing, wireless charging, and enhanced capabilities in a half-folded state.
A previous rumor from last week also mentioned the date of July 12. According to the source, the V2 will feature an LTPO AMOLED display with a higher refresh rate and high-frequency PWM dimming. It is speculated that the phone will be available in two versions: one equipped with the Snapdragon 8+ Gen 1 chipset from last summer and another with the current flagship Snapdragon 8 Gen 2 chipset. As the event approaches, it is hoped that Honor will reveal more details and features about the upcoming device.
Published on 07/8/23 4:07 | by Rawa John